Effect of UBM structure on Electromigration and thermomigration behavior in flip chip SnPb solder joints
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 99 === Electronic Packaging Technology is a process to fabricate all of the electronic devices in one interconnection structure. As the consumer electronic products move toward more lightly, thinner and smaller, we need higher density of input/output joints. The...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/82302035022980825453 |