Sn-Ag solder bump formation for flip-chip bonding by alloy plating
碩士 === 國立交通大學 === 工學院碩士在職專班半導體材料與製程設備組 === 99 === The trend of electronic products toward high performance, compact size, and lightweight requires an interconnection technology of high density such as a flip chip package. Flip-chip bonding is a method for mounting integrated circuit chips onto a...
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| Format: | Others |
| Language: | en_US |
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2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22182717700948111753 |