Thermal-Aware Placement for 3D FPGAs
碩士 === 國立交通大學 === 電子研究所 === 99 === Three-dimensional (3D) integration is an attractive way to continue sustaining Moore’s Law; however, it has a critical challenge – the thermal issue. Precise thermal analysis is time-consuming and thus it is impractical to be integrated into the placement process d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46671531215483379086 |