White Space Distribution and Thermal-Aware 3D IC Placement
碩士 === 國立交通大學 === 電子研究所 === 99 === The 3D IC technologies can improve circuit performance and reduce wirelength. However, its thermal problems have become more serious. In this thesis, we propose a thermal aware 3D IC placement by using 3D partition to reduce the number of through-silicon via and to...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20717950360207806785 |