Investigation of Electromigration Behavior of SnAg Based Solders with Cu and Au Electrodes
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 99 === In this study, the interfacial reactions, kinetics of intermetallic compound (IMC) formation and change of morphology of lead-free SnAg based solders with Cu and Au electrodes under electromigration (EM) were investigated. The present results include two se...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/54040513616765492331 |