Characteristics of Ru alloy thin films and their applications as the diffusion barrier/Cu-seed layer in integrated circuits
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 99 === In this study, the characteristics of Ru alloy thin films and their applications as the diffusion barrier/Cu-seed layer for interconnect in integrated circiuts are explored. The 15 nm Ru-N, Ru-Ta and Ru-Ta-N and 5 nm Ru-C thin films used in this study were...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20537488282632449210 |