Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm

Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm

碩士 === 國立成功大學 === 工程科學系碩博士班 === 99

Bibliographic Details
Main Authors: Chun-HaoChuang, 莊峻豪
Other Authors: Rong-Sheng Chen
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/97726978252027468843
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spelling ndltd-TW-099NCKU50280472016-04-08T04:22:29Z http://ndltd.ncl.edu.tw/handle/97726978252027468843 Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm 應用反應曲面法配合基因演算法進行單鑲嵌銅導線之應力誘發空洞現象最佳化設計 Chun-HaoChuang 莊峻豪 碩士 國立成功大學 工程科學系碩博士班 99 Rong-Sheng Chen 陳榮盛 2011 學位論文 ; thesis 141 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立成功大學 === 工程科學系碩博士班 === 99
author2 Rong-Sheng Chen
author_facet Rong-Sheng Chen
Chun-HaoChuang
莊峻豪
author Chun-HaoChuang
莊峻豪
spellingShingle Chun-HaoChuang
莊峻豪
Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
author_sort Chun-HaoChuang
title Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
title_short Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
title_full Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
title_fullStr Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
title_full_unstemmed Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
title_sort optimal design of stress-induced voiding phenomena in single damascene copper interconnect through response surface method with genetic algorithm
publishDate 2011
url http://ndltd.ncl.edu.tw/handle/97726978252027468843
work_keys_str_mv AT chunhaochuang optimaldesignofstressinducedvoidingphenomenainsingledamascenecopperinterconnectthroughresponsesurfacemethodwithgeneticalgorithm
AT zhuāngjùnháo optimaldesignofstressinducedvoidingphenomenainsingledamascenecopperinterconnectthroughresponsesurfacemethodwithgeneticalgorithm
AT chunhaochuang yīngyòngfǎnyīngqūmiànfǎpèihéjīyīnyǎnsuànfǎjìnxíngdānxiāngqiàntóngdǎoxiànzhīyīnglìyòufākōngdòngxiànxiàngzuìjiāhuàshèjì
AT zhuāngjùnháo yīngyòngfǎnyīngqūmiànfǎpèihéjīyīnyǎnsuànfǎjìnxíngdānxiāngqiàntóngdǎoxiànzhīyīnglìyòufākōngdòngxiànxiàngzuìjiāhuàshèjì
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