Optimal Design of Stress-induced Voiding Phenomena in Single Damascene Copper Interconnect Through Response Surface Method with Genetic Algorithm
碩士 === 國立成功大學 === 工程科學系碩博士班 === 99
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97726978252027468843 |