A Study on the Effect of Process Parameters on Chip Quality for Thin Wafer by Laser Dicing
碩士 === 國立中興大學 === 機械工程學系所 === 99 === As the density requirement of integrated circuit (IC) and the progress of in semiconductor technology. A short term is using stack die then do the assembly process for 3DIC integrated circuit become the main trend. The 3DIC is using the DAF to stack chip, it will...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46083251826364220827 |