Thermal stability and microstructure of Cu3Ge films
碩士 === 國立中興大學 === 材料科學與工程學系所 === 99 === In this study, we characterize the behaviors and properties of copper germanide(Cu3Ge) on two different substrates, SiO2 and NiSi, to evaluate the feasibility for contact plug application. Different to the reported formation process on Ge substrate, we deposit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31251453828431245095 |