The effects of strain on Ni/Sn interfacial reactions
碩士 === 中興大學 === 化學工程學系所 === 99 === Flip chip in package have been used extensively in electronic product, the advantage of small size, high density, good reliability has been discovered. Flip chip is made by solder joint and under bump metallurgy. To decrease copper atom reacting with solder, a diff...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/26986388363062052662 |