Electromigration study of Sn-3wt.％Ag-0.5wt.％Cu-(3~10wt.％)Bi solders

Electromigration study of Sn-3wt.％Ag-0.5wt.％Cu-(3~10wt.％)Bi solders

碩士 === 國立中興大學 === 化學工程學系所 === 99 === For the tendency of lead-free solder, the traditional SnPb solder has been replaced. Sn3Ag0.5Cu is similar with the traditional SnPb solder for many property tests. It has been the most popular Pb-free solder for consumer electronics packaging. But its melting po...

Full description

Bibliographic Details
Main Authors:	Shang-Hua Lee, 李尚樺
Other Authors:	陳志銘
Format:	Others
Language:	zh-TW
Published:	2011
Online Access:	http://ndltd.ncl.edu.tw/handle/19823713235616452825

Similar Items

The Properties of Composite Solders of Sn-3.0 wt.% Ag- 0.5 wt.% Cu alloy Added with Sn-10.0 wt.% Cu alloy
by: Chia-Yu Liu, et al.
Published: (2019)

Electromigration study of Sn-9 wt%Zn solder
by: Yu-Min Hung, et al.
Published: (2008)

Creep behaviour of the ternary lead-free solder alloy, Sn-3.8wt.%Ag-0.7wt.%Cu
by: Cooper, Shellene
Published: (2002)

Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite solder
by: Ibrahym Ahmad, et al.
Published: (2021-10-01)

Interfacial Reactions Between Sn-58 wt %Bi, Sn-0.7 wt% Cu Lead-free Solders and Alloy 42 Substrate.
by: Ruo-syun Syu, et al.
Published: (2009)

Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration
by: Ilha, Bernardo Bortolotto
Published: (2018)

The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint
by: Peng Xue, et al.
Published: (2020-12-01)

Intermetallic and Tensile Study of the Newly Developed Sn-2.0Ag-0.7Cu Solder with Addition of 0.5 wt.% Zinc
by: Azami, NA, et al.
Published: (2018)

Intermetallic and tensile study of the newly developed Sn-2.0Ag-0.7Cu solder with addition of 0.5 wt.% zinc
by: Andas J., et al.
Published: (2018)

Correlation of Thermal and Microstructural Properties of an Al-0.60wt%Mg-0.25wt%Fe-0.05wt%Cu Alloy Unidirectionally Solidified
by: Pedro LAMARÃO, et al.
Published: (2014-09-01)

Effect of 0.05 wt.% Pr Addition on Microstructure and Shear Strength of Sn-0.3Ag-0.7Cu/Cu Solder Joint during the Thermal Aging Process
by: Jie Wu, et al.
Published: (2019-09-01)

Interfacial reactions of Au-20wt.%Sn solder on Cu substrate
by: Hsiang-Mou Chung, et al.
Published: (2009)

Microstructure Evolution of Sn-3.5wt%Ag Solder Alloy under Current Stressing
by: Han-ChiehHuang, et al.
Published: (2014)

Corrosion and Leaching Behaviours of Sn-0.7Cu-0.05Ni Lead-Free Solder in 3.5 wt.% NaCl Solution
by: Jan-Ervin C. Guerrero, et al.
Published: (2018-01-01)

Simultaneous Increase of Electrical Conductivity and Hardness of Al–1.5 wt.% Mn Alloy by Addition of 1.5 wt.% Cu and 0.5 wt.% Zr
by: Nikolay Belov, et al.
Published: (2019-11-01)

Investigations on Microstructure and Properties of 16 wt% Cr-3 wt% B-0.6 wt% C-1 wt% Mn-Fe Alloy
by: Jiawei Ding, et al.
Published: (2018-07-01)

Co-Precipitation, Strength and Electrical Resistivity of Cu–26 wt % Ag–0.1 wt % Fe Alloy
by: Rui Li, et al.
Published: (2017-12-01)

Low Temperature and High Temperature Superplasticity in Zn-22 wt.% Al and Zn-22wt.% Al-0.3 wt.% Cu Alloys
by: Te-Hao Lee, et al.
Published: (2003)

Effects of solidification thermal parameters and Bi doping on silicon size, morphology and mechanical properties of Al-15wt.% Si-3.2wt.% Bi and Al-18wt.% Si-3.2wt.% Bi alloys
by: Marcelino Dias, et al.
Published: (2020-05-01)

Avaliação da tixoconformabilidade de ligas Al-Xwt%Si-2,5wt%Cu-0,5wt%Mg
by: Benati, Davi Munhoz, 1981-
Published: (2008)

Effect of Annealing Temperature on Microstructures and Mechanical Properties of As-Rolled Mg-9wt.%Li-3wt.%Al-1wt.%Zn Alloy Sheets
by: Shang-Chiu Lin, et al.

Mechanical property and Electrochemical Migration of the Sn-3Ag-0.5Cu-XNi(X=0.0~0.1 wt%) Reflowed on Cu-pads in various solution.
by: Chung-nan Peng, et al.
Published: (2007)

Thermal behavior, microstructure and mechanical property of the Bi-2.5 Ag added with 1.0 wt. % In, Sb and Sn
by: Kun-Chieh Chan, et al.
Published: (2017)

The Evaluation on Corrosion Resistance and Dross Formation of Zn–23 wt% Al–0.3 wt% Si–x wt% Mg Alloy
by: Wangjun Peng, et al.
Published: (2019-03-01)

Effect of copper addition on grain refinement of austenite in Fe-8wt.%Ni-(0.3)Wt.% Cu alloy
by: Junaidi Syarif, et al.
Published: (2010)

Microstructures and Mechanical Properties of As Hot-Rolled Fe-30wt.%Mn-10wt.%Al-0.9wt.%C Alloys
by: Yen, Shih-Hsun, et al.
Published: (2016)

Microstructure, Texture Evolution and Magnetic Properties of Fe-6.5 wt. % Si and Fe-6.5 wt. % Si-0.5 wt. % Cu Alloys during Rolling and Annealing Treatment
by: Zhaoyang Cheng, et al.
Published: (2018-02-01)

Multiscale modeling of a low magnetostrictive Fe-27wt%Co-0.5wt%Cr alloy
by: M. Savary, et al.
Published: (2018-05-01)

Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
by: Mohd Izrul Izwan Ramli, et al.
Published: (2021-09-01)

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb
by: Agata Skwarek, et al.
Published: (2020-02-01)

Room Temperature Mechanical Properties of A356 Alloy with Ni Additions from 0.5 Wt to 2 Wt %
by: Lucia Lattanzi, et al.
Published: (2018-03-01)

Microstructures and Mechanical Properties of As Hot-Rolled Fe-30.0wt.%Mn-9.3 wt.%Al-1.45 wt.%C Alloy
by: Cheng, Yu-Lin, et al.
Published: (2017)

Mechanical Property and Corrosion Resistance in Simulated Body Fluid of Gas-nitrided Fe-30wt.%Mn-10wt.%Al-1.0wt.%C Alloy
by: Huang, Jhen-Yi, et al.
Published: (2016)

Improved High Power GaN-LED Performance 1. Laser Lift-off GaN Epi-layer Grown on Patterned Sapphire Substrate 2. Reducing Thermal Resistance of Die-attach Material by Diamond add Sn-3wt.%Ag-0.5wt.%Cu solder
by: Chang, Tai-Min, et al.
Published: (2015)

The In-Situ Observation of Grain Rotation and Microstructure Evolution Induced by Electromigration in Sn-3.0Ag-0.5Cu Solder Joints
by: Xing Fu, et al.
Published: (2020-12-01)

The study of Electromigration on Lead-free SnAgBiIn Solder with Cu Electrodes
by: Kuo-Hao Sun, et al.
Published: (2009)

Study of Electromigration in Lead-Free SnAg3.8Cu0.7 Solder
by: Ying-Chao Hsu, et al.
Published: (2005)

Interconnection between microstructure and microhardness of directionally solidified binary Al-6wt.%Cu and multicomponent Al-6wt.%Cu-8wt.%Si alloys
by: ANGELA J. VASCONCELOS, et al.
Published: (2016-06-01)

Effect of cold work on the ageing and formability of a Cu 1.8wt% Be 0.25wt% Co alloy
by: Selcuk, Ahmet
Published: (1989)

Microstructure and Hot Deformation Behavior of the Mg–8 wt.% Sn–1.5 wt.% Al Alloy
by: Zhaoqian Sun, et al.
Published: (2021-04-01)