Electromigration study of Sn-3wt.％Ag-0.5wt.％Cu-(3~10wt.％)Bi solders
碩士 === 國立中興大學 === 化學工程學系所 === 99 === For the tendency of lead-free solder, the traditional SnPb solder has been replaced. Sn3Ag0.5Cu is similar with the traditional SnPb solder for many property tests. It has been the most popular Pb-free solder for consumer electronics packaging. But its melting po...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/19823713235616452825 |