Electroless Deposition of Barrier and Seed Layersof Through Silicon Via
碩士 === 國立中興大學 === 化學工程學系所 === 99 === The development of science is constantly progressing. The densification of electronic components continuously increases. In order to meet this general demand, many new three-dimensional (3D) electronic packaging technologies are now emerging, especially with th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00998999624929322458 |