The Fatigue Analysis of the Probe on Wafer Test

• Main Authors: Bo-Yi Liao, 廖博益
• Other Authors: Kao-Hua Chang
• Format: Others
• Language: zh-TW
• Published: 2011
• Online Access: http://ndltd.ncl.edu.tw/handle/45041926934465994896

碩士 === 國立高雄應用科技大學 === 模具工程系 === 99 === This study shows the finite element software ANSYS to analysis the tungsten probe contact the aluminum pad of the chip on wafer test process. The probe will contact the pad and produce the scratch in wafer testing process. First of all, the temperature on the wafer test is 25℃. The overdrive (OD) is 50μm. Then, comparing the probe-experimental data and the results of analysis are in good agreement. Secondly, using the Taguchi method to analyze the magnitudes of the fatigue life of the probe contact the aluminum pad on wafer, the testing conditions are: (a) the probe geometry sizes will be changed are the tip diameter, the bending angle and the beam length, respectively., (b) the temperatures are 75℃, 150℃ and 300℃, respectively., And, (c) the materials of the probe are tungsten, iron, SUS304 stainless steel, SUS316L stainless steel and SKD11 tool steel, respectively. And, the noise factors (overdrive) are 20, 40, 50, 60 and 80μm, respectively. Lastly, we analysis the results of Taguchi method, and bring up the optimization fatigue life conditions under the noise factors.