The Fatigue Analysis of the Probe on Wafer Test
碩士 === 國立高雄應用科技大學 === 模具工程系 === 99 === This study shows the finite element software ANSYS to analysis the tungsten probe contact the aluminum pad of the chip on wafer test process. The probe will contact the pad and produce the scratch in wafer testing process. First of all, the temperature on the w...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45041926934465994896 |