The Study of De-flash Process on Exposed Die Paddle Delamination for Quad Flat Non-Leads（QFN）Package
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 99 === This main part of this thesis is concerning with the delamination phenomenon of Quad Flat Non-Leads package (QFN) between molding compound and expose die paddle in IC package assembly factories. The characteristic of QFN Package is the technology of single...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20630379254674882576 |