A study of solder hermetic sealing process and reliability for Micro Electro Mechanical Systems package
碩士 === 國立高雄應用科技大學 === 化學工程與材料工程系 === 99 === Part of MEMS package apply hermetic package to keep MEMS micro structure from stiction and damping change under low humidity or low pressure, also keep it from corrosion. Solder sealing material is currently major approach with high UPH, low cost and compa...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/78757617972958734530 |