Analyse Copper and Aluminum metal properties of nanometer-scale bounding using molecular dynamics simulation

碩士 === 國立高雄應用科技大學 === 應用工程科學研究所 === 99 === This study analyzed the joining effects of FCC structures such as pure copper, pure aluminum, and binary alloy (Al0.9Cu0.1) in nano-scale based on molecular dynamics using EAM (embedded-atom method) potential. In order to enhancement simulation efficiency,...

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Bibliographic Details
Main Authors: Cheng, Yen-Yu, 鄭延瑜
Other Authors: Hsu, Quang-Cherng
Format: Others
Language:zh-TW
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/77239964217776442603