Analyse Copper and Aluminum metal properties of nanometer-scale bounding using molecular dynamics simulation
碩士 === 國立高雄應用科技大學 === 應用工程科學研究所 === 99 === This study analyzed the joining effects of FCC structures such as pure copper, pure aluminum, and binary alloy (Al0.9Cu0.1) in nano-scale based on molecular dynamics using EAM (embedded-atom method) potential. In order to enhancement simulation efficiency,...
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Format: | Others |
Language: | zh-TW |
Published: |
2011
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Online Access: | http://ndltd.ncl.edu.tw/handle/77239964217776442603 |