| Summary: | 碩士 === 高雄醫學大學 === 醫藥暨應用化學研究所 === 99 === In semiconductor engineering IC packing process, the epoxy molding compound will contact some materials like IC surface coating layer, substrate, heat slug under forming, the following process will bring thermal stress to the packed IC due to different thermal process, at this time the adhesion force between packed materials can not resist thermal stress that will lead to fail, this failure mode is that exist a space between molding material and other materials, that called delamination in semiconductor engineering. Delamination will bring lower yield and worse reliability test capability issued, so that would like to prevent this issued that must increase adhesion force between packing materials to a good level to resist thermal stress by thermal process.
This paper investigate to increase adhesion force between molding material and organic coating material polyimide on the IC surface by semiconductor plasma treatment process. Investigating the physical and chemical property of organic coating material polyimide on the IC surface by using different parameter of plasma treatment, physical property including etching thickness, water angle, roughness and surface area raising percentage of surface; chemical property including quality and quantity of hydrogen bonding of surface, finally that will define the optimal parameter by adhesion force test .The investigation showed that percentage of hydrogen bonding of surface achieve highest and surface adhesion force test achieve highest , too , by this test method it can be define the plasma treatment optimal parameter categorically.
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