Investigating the optimal adhesion condition of Polyimide to Epoxy Resin Molding Material
碩士 === 高雄醫學大學 === 醫藥暨應用化學研究所 === 99 === In semiconductor engineering IC packing process, the epoxy molding compound will contact some materials like IC surface coating layer, substrate, heat slug under forming, the following process will bring thermal stress to the packed IC due to different thermal...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13625165907554656226 |