Application of Package On Package Technology on BGA Rework Process
碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 99 === Surface Mount Technology (SMT) has been a major part for electronic assembly industry in Taiwan. So far, most of SMT technology process study focus on mass production or new materials but rarely discuss in BGA rework process. Ball Grid Array (BGA) rework pr...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06298057948777831217 |