| Summary: | 碩士 === 中原大學 === 電子工程研究所 === 99 === In integrated circuit processing, the issue of wafer defects is very important for elevating the product yield. Wafer defects show an even stronger impact on the product yield as the circuit dimension shrinks. In semiconductor processing, the steps such as photolithography, etching, thin film deposition, diffusion, and chemical mechanical polishing will introduce defects; otherwise, the suspended matters in the environment, such as: dust, solvents, gas molecules are the sources of wafer defects. How to reduce the number of wafer defects and increase the analysis efficiency of the origin of wafer defects is the goal that each wafer fab is constantly striving for.
This article reports on how to identify the origin of the circular defects found in IC wafer processing through an experimental investigation. Based on the analysis of data obtained, the source of the wafer defects is suggested to be the suspended particles in the clean-room environment, originated from the ink molecules of color inkjet printer during its operation.
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