Optimum Design for Cu Wire Bonding Process by Applying DOE Method
碩士 === 中原大學 === 工業與系統工程研究所 === 99 === The cost of gold has been dramatically increasing, therefore copper wire has been used to replace gold wire as conduction material. Regarding copper wire capability, if atmospheric temperature is under room temperature (about 20 degrees), the copper wire resisti...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98380893854804969541 |