Analysis and Investigation of the Board Level Drop Test and Simulation to the CMOS Image Sensor
碩士 === 中華大學 === 機械工程學系碩士班 === 99 === Solder joint reliability is of great concern to semiconductor and electronic product manufacturers. Due to rapid advancements in the electronic industry, packages with fine pitch ball grid array have been increasingly used in portable electronic devices....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/67426423673951306146 |