Thermal, Mechanical, and Reliability Analyses of High-Power LED Packages and Their Modules
博士 === 長庚大學 === 機械工程學系 === 99 === The study is aimed to investigate the thermal behaviors, reliability, and die strength of a chip-on-plate (COP) high-power light emitting diode (LED) package and its module, which features low cost and low-junction temperatures (Tj). The thermal and optical reliabil...
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| Format: | Others |
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2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/88144689777688811521 |