Study on Buckling Behavior of Ultra Thin Wafer Under BOR Test
碩士 === 國立中正大學 === 機械工程學系暨研究所 === 99 === The buckling behaviors of ultra-thin wafers under BOR (Ball On Ring) tests are investigated based on experimental observations and finite element analyses. Specimens with a length of 15mm, a width of 15 mm, and two thicknesses of 25 and 50 μm are used. The e...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22323305268074884430 |