Development of Numerical Simulation Models for Analysis Thermal Stress of Through-Silicon-Via with Composite Filler Materials
碩士 === 國立中正大學 === 機械工程學系暨研究所 === 99 === In recent years, multi-layer chip-stacking and reduce the size of chip have become important technology for three dimensional chip stacking packages. Through-silicon-via (TSV) is the most important technology for chip-stacking at present. Filled metal connect...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50475100606603279211 |