Applying Six-Sigma Methodology to Improve Rough Polishing Process Capability in Reclaim Wafer
碩士 === 國立勤益科技大學 === 工業工程與管理系 === 99 === The six sigma can reduce the costs by using the quality control and statistics effectively. The study which analyzes the process of polishing on reclaim wafer by means of six sigma and DMAIC, which are Define, Measure, Analyze, Improve, and Control finds the i...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2011
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70792058887509846186 |