Soldering of Magnesium Alloys and Copper
碩士 === 雲林科技大學 === 機械工程系碩士班 === 98 === In this study, the lead-free solders Sn3Ag0.5Cu with four different proportions of AZ31 magnesium alloy, Sn3Ag0.5Cu and Sn3Ag0.5Cu+1%AZ31+0.1Mm filler metal alloys were used to join magnesium alloy with copper. Using the Sn3Ag0.5Cu lead-free solder with the add...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90863395958130829622 |