Low Cost Design and Realize of Multi Mode and Dual Band RF Frond-End Module for IEEE 802.11a/b/g/n
碩士 === 淡江大學 === 電機工程學系碩士在職專班 === 98 === In this thesis, Sip (System-In-Package) packaging is employed to design a low-cost multi-mode dual-band RF front-end module (FEM), to reach its goal of size-reducing and meet the RF performance requirements, in response to the trends of the current mobile prod...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00411978761238319905 |