Mechanical Properties of Composite Pb-free Solder Joints In Ball Grid Array
碩士 === 國立臺北科技大學 === 製造科技研究所 === 98 === This study mainly investigates the usage of the elements-Nickel(Ni) or Iron(Fe) to strengthen the welding composite material and improves their mechanical properties as a solder in the application of Ball Grid Array .In this study ,a 10~15μm of Ni metallic part...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/a668y3 |