The effect of non-reactive alloying elements on the growth kinetics of the intermetallic compound between liquid Sn-based solders and Ag substrate
碩士 === 國立臺北科技大學 === 化學工程研究所 === 98 === This study investigated the effect of the non-reactive alloying elements on the growth kinetics of the intermetallic compound (IMC) formed between liquid Sn-based solders and Ag substrate between the temperature of 260-290℃. Experimental results showed that Sb,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22t459 |