Analyze the Defect Factor to Improve Process Yield of Semiconductor with ANP and Delphi Method

• Main Authors: Ta-Chun Chou, 周大鈞
• Other Authors: 張洝源
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/r78sxg

碩士 === 國立虎尾科技大學 === 工業工程與管理研究所 === 98 === Taiwan, as being the leader of semiconductor industry, as well as the world number one player of the market share in the foundry industry, in order to continuously maintain the advantage for its foundry industry, the production yield of chip is always the key indicator for Taiwan’s semiconductor manufacturing industry; however, the reduction of defects in chips will be the best solution to improve the chip yield. Therefore, this study is mainly to explore the factors of causing defects of Chemical Vapor Deposition (CVD) Chip in the manufacturing process of semiconductor with conducting the screening and evaluation, and then sorted out the key factors of influencing and causing the defect in products so as to improve the product yield, increase the productivity and create benefit for relevant companies. This study has adopted the literature review and conducted the factor screening and evaluation together with professional personnel of the semiconductor industry, and made use of the Cause-and-Effect Diagram to find out the key factor of each influential defect by way of these 4 major aspects: manpower, equipment, material and methodology. Moreover, Delphi Method and Analytical Network Process (ANP) have been used to determine the importance weight of each factor in order to explore the key factor in causing defects in CVD Chip. In the research result, it discovered that the most important item of influencing the weight is the factor of abnormal parts, and this result can be provided as the reference to resolve the defects in the semiconductor manufacturing industry.