Effect of additives on the kinetics of immersion micro-plating of copper
碩士 === 國立聯合大學 === 化學工程學系碩士班 === 98 === The main purpose of this experiment was to discuss the development of new additives to copper deposition on the mechanism and kinetics. The first part of the based solution of low-conc. copper with high acidity were to the electrochemical analyzer to make cycli...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23172149745094287478 |