| Summary: | 碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 98 === Since screen printing has advantages of mass production and low cost, it is the popular solder bump process. The Solder Bump is a connector on the UBM (Under Bump Metallurgy) in Wafer Bump assembly process. It usually is produced by solder plating or solder printer process, however the void appear in the fine scale solder bump in screen printing process, cause bump break and shift moving in the Flip Chip process. For this study, we will explore in screen printing process, the effect of parameters in reflow process such as heating/cooling curve, improve solder bump process to the formative of the bump voids. As a result, by control way the heating/cooling curve property, we can improve the solder bump failure rate and improve the yield of the screen print process. It is found that the maximum heating temperature should be set to higher than the eutectic temperature of Pb/Sn alloy, and a minimum cooling rate is necessary for the transfer motion from liquid to solid phase at equilibrium state.
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