The Study of the Bump Void Improvement for Solder Bump Reflow Process
碩士 === 國立高雄大學 === 電機工程學系--先進電子構裝技術產業研發碩士專班 === 98 === Since screen printing has advantages of mass production and low cost, it is the popular solder bump process. The Solder Bump is a connector on the UBM (Under Bump Metallurgy) in Wafer Bump assembly process. It usually is produced by solder platin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22529847989244177823 |