Fill material on phase change materials impact study
碩士 === 國立臺灣科技大學 === 機械工程系 === 98 === Abstract The human began using computers, PC computing power continues to increase, the relative power and cooling issues become unavoidable. Generally speaking, the PC main heat source from CPU, motherboard ( Northbridge and southbridge, VRM part ), display adap...
Main Authors: | LEE TSUNG-CHANGE, 李宗昌 |
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Other Authors: | Shun-Tian Lin |
Format: | Others |
Language: | zh-TW |
Published: |
2010
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Online Access: | http://ndltd.ncl.edu.tw/handle/53142692961546163826 |
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