Fill material on phase change materials impact study

碩士 === 國立臺灣科技大學 === 機械工程系 === 98 === Abstract The human began using computers, PC computing power continues to increase, the relative power and cooling issues become unavoidable. Generally speaking, the PC main heat source from CPU, motherboard ( Northbridge and southbridge, VRM part ), display adap...

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Bibliographic Details
Main Authors: LEE TSUNG-CHANGE, 李宗昌
Other Authors: Shun-Tian Lin
Format: Others
Language:zh-TW
Published: 2010
Online Access:http://ndltd.ncl.edu.tw/handle/53142692961546163826