| Summary: | 碩士 === 國立臺灣科技大學 === 機械工程系 === 98 === Abstract
The human began using computers, PC computing power continues to increase, the relative power and cooling issues become unavoidable. Generally speaking, the PC main heat source from CPU, motherboard ( Northbridge and southbridge, VRM part ), display adapters, and other components such as hardware, optical drives, and so on, these original operation consumes a substantial part of it into heat.
Original operating temperature directly to determine their service life and stability, in order to allow various parts PC working temperature remains within reasonable limits, in addition to confirm PC working environment temperature within reasonable limits, you must to thermal processing. Especially for CPU, if the user is overclocked to guarantee their stable work more effective heat dissipation.
To effective heat transfer to the heat sink or heat radiation module, a wide range of thermal interface material, thermal paste, are common conductive gasket and phase change materials, etc. These materials are the use of organic and inorganic materials are mixed and effective decentralization and shaping, the use of organic materials some processing characteristics, such as silicone resin temperature resistance and coating of the inorganic materials with good thermal properties, to address the needs of the electronic component cooling.
This paper focuses on phase change materials, is principally a phase change material than heat conduction paste operations, and the ratio of heat sink a better thermal effect. The most common phase change materials with high thermal conductivity are mainly to Japan, America, and Taiwan almost no phase change materials.This study from (1) different polymer materials for phase change, phase change points to identify the most appropriate polymer substrate. (2) Different metal components and the composition of the polymer substrate, find out the optimization of composition and proportions, and achieve effective heat conduction.
In testing by ASTM-5470 volume meter of heat conduction and thermal module of experimental measurements to verify.
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