| Summary: | 碩士 === 國立臺南大學 === 機電系統工程研究所碩士班 === 98 === The running rate of electronic components is more and more quickly, the density of electronic circuit implanted the chip are becoming increasingly. The heat of per unit chip also increases. Therefore, electronic cooling has become a concerned matter. The cooling method of impinging jet flow combined plate-fin heat sink is most widely used. It includes many advantages, such as rapid heat removal, high efficiency and partial cooling. It can dispense heat in the limited space.
The purpose of this study is to discuss the heat transfer phenomena of plate-fin heat sinks under high velocity jet cooling. The characteristic of impinging cooling is to increase the quantity of heat removal in the heated region. The finite element method is used to simulate, and the results are compared with the experiment to obtain the accuracy of this study. The parameters discuss in this study including the size of the fin, the Reynolds number and the impingement distance. Through the results of this study, we find that the effect of Reynolds number dominates to the heat removal. The heat removal increases as the Re increases obviously. In addition, the temperature profile of the surface of the fin is affected by the arrangement of the fin.
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