The heat transfer analysis of plate-fin heat sinks by high velocity impinging jet flow
碩士 === 國立臺南大學 === 機電系統工程研究所碩士班 === 98 === The running rate of electronic components is more and more quickly, the density of electronic circuit implanted the chip are becoming increasingly. The heat of per unit chip also increases. Therefore, electronic cooling has become a concerned matter. The coo...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/01681811562248589686 |