Implementation of TSV Embedded MEMS Device for 3D Packaging and Integration
博士 === 國立清華大學 === 奈米工程與微系統研究所 === 98 === Due to the development of portable consumer products, minimization and multi-functions of an electronic device is the next challenge for the semiconductor industry. Sensing function and integration compatibility provided by micromachining technology is the pr...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49406359620090635172 |