Thermal Effects on Cu Wire Bonding by Using Finite Element Simulation
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 98 === Wire bonding has been used in integrated circuit packaging for many years which has been more full-grown than other bonding methods, and gold wire has been the preferred choice. Because of the rising price of gold every year, copper wire has been increasin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/eqmj3n |