The Study of Creep and Shear Tests for Sn/3.0Ag/0.5Cu Solder Balls
博士 === 國立中山大學 === 機械與機電工程學系研究所 === 98 === The creep models of Sn/3.0Ag/0.5Cu solder material under tensile and shear loads are investigated in this study. The creep test results for Sn/3.0Ag/0.5Cu solder material with four operating temperatures, i.e. 120o, 135 o, 150 o and 165 oC are presented. The...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16460862343301619012 |