Mechanical properties of intermetallic phases at solder joint interface–crystal orientation and metallurgical effects
碩士 === 國立東華大學 === 材料科學與工程學系 === 98 === Cu6Sn5 is the most common intermetallic compound (IMC) at the interface of Pb-free solder joints. Considering that IMC plays a crucial role for the joint reliability, this study investigated the orientational and metallurgical dependences on the mechanical pro...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98682212568805902559 |