Heat Dissipation Research on IC Package

• Main Author: 蔡芳霖
• Other Authors: 沈志雄
• Format: Others
• Language: zh-TW
• Published: 2010
• Online Access: http://ndltd.ncl.edu.tw/handle/17929442415193805130

碩士 === 國立彰化師範大學 === 機電工程學系 === 98 === As a result of recent years IC the potency promotion, the high heat source which the chip produced has become the semiconductor seal system regulation the technical bottleneck, to reduce the potency which and the reliable question the chip gives off heat creates, the chip seals radiation ability will be an important design topic, but this topic will affect the development which the following higher order semiconductor seals. The present paper uses the ANSYS software, (nodal analysis) carries on the analysis by the univariate heat conduction analysis nowadays the field different structure Z axial stable state hot distribution, and compares the terminal user to use the different pattern to disperse the hot blast to disperse the different heat convection to the stable state temperature performance. Because this research neglects between various materials in the heat conduction process the thermal resistance change and Partial materials to overall heat transfer influence, therefore has in the whole research with the material object-decides the magnitude of error existence. Although this magnitude of error will affect this research final output accuracy, but to ask the magnitude of error to drop to lowly, in this various materials attribute, the size define to same, and supposition various structures have designed are the optimization, during its various structures the error achieves as far as possible in order to is smallest. The analysis result discovered that the seal syntagma's evolution, by the PBGA development to products and so on FCBGA, CiSP perhaps HS-FCBGA, its heat transfer effect profit approximately may promote 7~8%, but by the high heat conduction radiation medium or the high fever counter-flow ventilator analysis, its benefit is not obvious, therefore the future will radiate the industrial development core should emphatically in the entire radiation mold train development, but non- dark Promotion seal volumetric heat transmission ability.