Heat Dissipation Research on IC Package
碩士 === 國立彰化師範大學 === 機電工程學系 === 98 === As a result of recent years IC the potency promotion, the high heat source which the chip produced has become the semiconductor seal system regulation the technical bottleneck, to reduce the potency which and the reliable question the chip gives off heat cre...
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| Format: | Others |
| Language: | zh-TW |
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2010
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17929442415193805130 |