Pin Assignment and Substrate Routing on BGA Package Considering Differential Pairs and IR Drop
碩士 === 國立交通大學 === 電子工程系所 === 98 === While the advanced very large scale integration (VLSI) circuit is scaling to deep-submicrometer (DSM) technology, the complication in designing chips, packages and the communications between package and board become increasingly significant. The iterative interfac...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/59222798394597535911 |