Influence of IC substrate surface finish joints with Pb-free solder in reliability test
碩士 === 國立交通大學 === 管理學院碩士在職專班工業工程與管理組 === 98 === For electronic packaging, BGA (Ball Grid Array) substrate connects to PCB (Printed Circuits Board) by using solder ball welding process, solder joints may cause cracks while the electronic components get an accidental drop. The solder joints strength d...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/06915771519535249786 |